"Smartphone" Litmus Future Water Cooler

Ever feel excessive heat while wearing high-performing smartphone? Along with the mobile processor performance is increasing, the issue is starting to be a serious problem.
Not only because they interfere with the comfort, but also can affect the stability of the device in question. So, how do I overcome this?
Mid-May, NEC, a Japanese manufacturer, introduced its first smartphone models equipped with liquid-based heat shock. The name of the smart phone is the Medias X.
How the technology works in Medias X heat shock similar to the engine cooling system on motor vehicles, using liquid piped to a heat source (the processor), and then taken to the "radiator" to remove heat.
NEC claims this method is able to effectively reduce the heat generated by high-performance processor smartphone.

The good news, as reported by DigiTimes, the big players sort of Apple, Samsung, and HTC are interested in using technology similar heat shock on its products.
The website quoted sources saying that the producers are going to start off with a smartphone-based cooling fluid, the earliest in the fourth quarter of this year.
Liquid-based cooling is long known in the computer world with the name "watercooling" or "heatpipe".
However, for applications in smartphones, the size of the cooling system should be shortlisted as small as possible. Pipe based fluid (heatpipe) on the NEC Medias X, for example, only 0.6 mm in diameter, much smaller than a similar pipe on thin ultrabook laptop that has a diameter of 1-1.2 mm.
Currently there are several manufacturers of components that are capable of producing 0.6 mm diameter heatpipes, including Furukawa Electric, Auras, TaiSol Electronics, and Chaun-Choung Technology. However, they are still manufacturing methods have improved as only capable of producing the level of output (yield rate) of 30 percent.